Spectek RMA Resolution
Spectek RMA Resolution
Support Team Email
Subject
Email Template Path
First Name
Last Name
Email
Phone
Fax
Address 1
Address 2
City
State
Country
Zip Code
Region
Americas
China
EMEA
India
Japan
Korea
Southeast Asia
Taiwan
Company
Company Website
Title, Position, Job Function
Technology or Product Family
DRAM
NAND Flash
Wireless/Embedded
Issue Category
Administrative
Electrical/Performance
Mechanical
Shipping Damage
Problem Description
Part Number, Product Grade, Laser Mark Code
Batch Number
Original Shipment Quality
How many components/modules have been tested?
How many components/modules failed?
How many components/modules are you returning?
How many passing components/modules are you returning?
How many failing components/modules are you returning?
What application was this tested in? (E.g. component tester)
Is there a failure/error message?
Yes
No
Component tester make/model?
Motherboard/Tablet Manufacturer?
Bios?
Processor?
Chipset?
What speed was the device being tested at?
What were the timing specs? (e.g. CL, tRCD, tRP, tRAS, etc…)
What temperature was the device being tested at?
What voltage was applied to the device?
Module Chip Count? (e.g. 4, 8, 16, etc…)
Module Form Factor? (e.g. UDIMM, SODIMM, etc…)
Any additional testing conditions when the failure appeared?
Have you referenced the SpecTek DRAM Buyer’s Guide?
Yes
No
Is your setup a valid setup in the SpecTek DRAM Buyer’s Guide? is required.
Yes
No
How many passing parts are you returning?
How many failing parts are you returning?
How many parts have been tested?
How many parts failed?
Is there a failure/error message?
Yes
No
What are your testing conditions? (e.g. temp, test equipment, programs, revisions, etc...)
What chipset was used for qualification?
Is a controlled(s) involved?
Yes
No
What version of Firmware (Mass Production tool) was used and what error codes/messages are they encountering?
Is this combination currently on SpecTek’s Approved Controller List?
Yes
No
Who is the technical contact most familiar with the problem?
If different than yourself, what is their contact information?
Have you observed any physical damage to the components? (e.g. cracked packages, bent leads, missing balls, etc…)
Yes
No
Describe the application in which the components are being used (e.g. USB, SSD, Wireless, Embedded, etc…)
Additional Questions/Comments?
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