Solving the toughest challenges requires a compute foundation with fast memory. Our HBM2E delivers the necessary performance, massive parallelism and power efficiency for next-generation data centers and high-performance compute systems.
Read our new tech brief for best practices from Micron experts on how you and your ecosystem of integrators can achieve maximum performance from the high-performance memory in Micron’s ultra-bandwidth solutions portfolio.
The stacked silicon miracles of high-performance memory
When nothing else matters but speed. Rebecca Lewington talks with Micron VP Akshay Singh, who leads the R&D team that created Micron’s amazing HBM2E memory in-package memory. TSV interconnect is just one thing that makes our stacked memory so fast.
This infographic tells what HBM2E is, why it’s necessary for applications like AI and high-performance computing and why being closer to the CPU matters for high-bandwidth performance.
