Software License Agreement

Micron Technology, Inc. Software License Agreement


PLEASE READ THIS LICENSE AGREEMENT (“AGREEMENT”) FROM MICRON TECHNOLOGY, INC. (“MTI”) CAREFULLY: BY INSTALLING, COPYING OR OTHERWISE USING THIS SOFTWARE AND ANY RELATED PRINTED MATERIALS (“SOFTWARE”), YOU ARE ACCEPTING AND AGREEING TO THE TERMS OF THIS AGREEMENT. IF YOU DO NOT AGREE WITH THE TERMS OF THIS AGREEMENT, DO NOT DOWNLOAD THE SOFTWARE.

LICENSE: MTI hereby grants to you the following rights: You may use and copy the Software and redistribute it to third parties subject to the terms of this Agreement. You must maintain all copyright notices on all copies of the Software. MTI may make changes to the Software at any time without notice to you. In addition MTI is under no obligation whatsoever to update, maintain, or provide new versions or other support for the Software.

OWNERSHIP OF MATERIALS: You acknowledge and agree that the Software is proprietary property of MTI and is protected by United States copyright law and international treaty provisions. Except as expressly provided herein, MTI does not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. You further acknowledge and agree that all right, title, and interest in and to the Software, including associated proprietary rights, are and shall remain with MTI. This Agreement does not convey to you an interest in or to the Software, but only a limited right to use, copy and redistribute the Software in accordance with the terms of this Agreement. The Software is licensed to you and not sold.

DISCLAIMER OF WARRANTY: The Software is provided “AS IS” without warranty of any kind. MTI EXPRESSLY DISCLAIMS ALL WARRANTIES EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, NONINFRINGEMENT OF THIRD PARTY RIGHTS, AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. MTI DOES NOT WARRANT THAT THE SOFTWARE WILL MEET YOUR REQUIREMENTS, OR THAT THE OPERATION OF THE SOFTWARE WILL BE UNINTERRUPTED OR ERROR-FREE. FURTHERMORE, MTI DOES NOT MAKE ANY REPRESENTATIONS REGARDING THE USE OR THE RESULTS OF THE USE OF THE SOFTWARE IN TERMS OF ITS CORRECTNESS, ACCURACY, RELIABILITY, OR OTHERWISE. THE ENTIRE RISK ARISING OUT OF USE OR PERFORMANCE OF THE SOFTWARE REMAINS WITH YOU. IN NO EVENT SHALL MTI, ITS AFFILIATED COMPANIES OR THEIR SUPPLIERS BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, INCIDENTAL, OR SPECIAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF YOUR USE OF OR INABILITY TO USE THE SOFTWARE, EVEN IF MTI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Because some jurisdictions prohibit the exclusion or limitation of liability for consequential or incidental damages, the above limitation may not apply to you.

TERMINATION OF THIS LICENSE: MTI may terminate this license at any time if you are in breach of any of the terms of this Agreement. Upon termination, you will immediately destroy all copies the Software.

GENERAL: This Agreement constitutes the entire agreement between MTI and you regarding the subject matter hereof and supersedes all previous oral or written communications between the parties. This Agreement shall be governed by the laws of the State of Idaho without regard to its conflict of laws rules.

CONTACT: If you have any questions about the terms of this Agreement, please contact MTI’s legal department at (208) 368-4500.

By clicking on the Accept button, you agree to the terms of the License Agreement. You must agree to the terms in order to download the software.

NDA Agreement

Micron Technology, Inc. NDA Agreement

To access these documents, you must first read and accept Micron’s electronic non-disclosure agreement. If the Recipient has a written confidentiality agreement with Micron Technology, Inc. you will need to click “Accept” at the bottom of this page, but the terms of the written confidentiality agreement will apply.

ON-LINE NONDISCLOSURE AGREEMENT THIS IS A LEGAL AGREEMENT BETWEEN YOU OR THE COMPANY YOU REPRESENT (EACH A “RECIPENT”) AND MICRON TECHNOLOGY, INC. (“MTI”) STATING THE TERMS AND CONDITIONS THAT GOVERN THE CONFIDENTIALITY OF INFORMATION POSTED TO OR MADE AVAILABLE THROUGH THE MICRON WEBSITE. PLEASE CAREFULLY READ THIS NONDISCLOSURE AGREEMENT (“AGREEMENT”) BEFORE CLICKING “ACCEPT” AT THE BOTTOM OF THE PAGE. BY CLICKING ON”ACCEPT”, RECIPIENT IS AGREEING TO BE BOUND BY THE TERMS OF THIS AGREEMENT. IF RECIPIENT DOES NOT AGREE TO THE TERMS OF THIS AGREEMENT, PRESS “DECLINE” AND RECIPENT WILL BE UNABLE TO ACCESS CONFIDENTIAL INFORMATION.

1. Written Nondisclosure Agreement. If Recipient and MTI have entered into a written confidentiality agreement (“Confidentiality Agreement”) that is in effect as of the date Recipient enters into this Agreement and such Confidentiality Agreement already applies to and governs the Confidential Information (defined below), then the terms of such Confidentiality Agreement shall apply to and govern Recipient’s obligations concerning such Confidential Information and not the terms of this Agreement.

2. Confidential Information. “Confidential Information” means any information or data posted to or made available through MTI’s secure website that is
(i) marked or labeled as “Confidential” or “Proprietary” or with similar designation, or
(ii) of a nature that a reasonable person would know such information is confidential.

 

Confidential Information does not include that which:

(i) is proven by Recipient through competent evidence to rightfully have already been in Recipient’s possession at the time of disclosure without an obligation of confidentiality;
(ii) is or becomes available to the public through no fault or breach on the part of Recipient;
(iii) is independently developed by Recipient without use of or reference to the Confidential Information; or
(iv) is rightfully obtained from a third party who has the right to transfer or disclose it to Recipient without restriction. 

12. Injunctive Relief. Recipient acknowledges and agrees that disclosure of Confidential Information in violation of the terms of this Agreement will cause irreparable harm to MTI for which monetary damages would not be an adequate remedy. Therefore, Recipient agrees that, in addition to any other remedies available to MTI, in the event of any breach or threatened breach of this Agreement, MTI shall be entitled to injunctive relief and Recipient waives any requirement for the posting of a bond in connection therewith.

13. No Implied Waiver. MTI’s failure or delay in exercising any of its rights hereunder will not constitute a waiver of such rights unless expressly waived in writing.

14. General. This Agreement:
(i) may be amended or modified only by an express writing signed by Recipient and an authorized representative of MTI;
(ii) will not be construed as creating any joint venture, partnership or other form of business association between the parties hereto;
(iii) is not assignable or delegable in whole or in part by Recipient without the express written consent of MTI;
(iv) shall inure to the benefit of and be binding upon the parties, their successors, the assigns of MTI and the permitted assigns of Recipient; and
(v) is in the English language only, which language shall be controlling in all respects, and all versions of this Agreement in any other language shall not be binding on the parties hereto.

15. Authorized Signatory. The individual clicking on “Accept” is entering into this Agreement and accessing Confidential Information either
(1) as an individual, and hereby agrees that he or she shall be personally liable to MTI if Confidential Information is disclosed or used in a manner not authorized by this Agreement, or
(2) on behalf of an employer or other entity, and hereby represents and warrants that he or she has full legal authority to bind such employer or entity to this Agreement and that such employer or entity shall be legally bound by all of the terms and conditions of this Agreement as Recipient hereunder.

IF CONFIDENTIAL INFORMATION IS FOR AN EMPLOYER OR ENTITY, BUT YOU DO NOT HAVE THE LEGAL AUTHORITY TO SO BIND SUCH EMPLOYER OR ENTITY, THEN DO NOT ACCESS, VIEW, READ, OR DOWNLOAD IN ANY WAY CONFIDENTIAL INFORMATION, AND DO NOT CLICK ON “ACCEPT.”

In order to review documents, you must accept the NDA. If you do not accept these terms, select Cancel to exit this menu.

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Export Compliance Certification (ECC)

Micron Technology Inc. ECC Agreement

To access this information, you must agree to comply with all applicable U.S. export control restrictions, including all laws, regulations, and requirements.  By clicking “I Agree” below, you agree to comply with those restrictions, including that:

  • You agree not to transfer or export the information:
    • To any non-U.S. person or location without obtaining all necessary approvals from the U.S. Government
    • To any restricted countries such as the Crimea Region (including the Donetsk People’s Republic (DNR) and Luhansk People’s Republic (LNR) regions), Russia, Belarus, Cuba, Iran, North Korea, and Syria or to any sanctioned persons prohibited from receiving U.S. items or services
  • You will refrain from using the information for activities related to the development, production, or support of advanced integrated circuits (ICs) at a semiconductor facility, or for the development, production, or support of supercomputers, in China or Hong Kong.
  • You are not accessing the information for non-U.S. military activities (including activities related to weapons of mass destruction) or for the benefit of non-U.S. military entities or end users.
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    デバイス開発職

    デバイス開発職 / Device Development

    トランジスタ、キャパシタなどにおける新技術の確立や、プロセス開発の成果をインテグレート（統合）し、DRAMなどの半導体デバイスのウェハ処理工程の統合を行います。製品に要求されるトランジスタ性能、配線性能を引き出し、高性能・高信頼性を維持するとともに、低コストでの量産を実現するウェハ処理工程の確立を担います。

    WorkStyle_1    インテグレーション
    より小さいチップサイズの実現はDRAM開発にとって重要な課題であり、競合他社間で凌ぎを削っています。 インテグレーションは、微細化にともない、高まるトランジスタやキャパシタの高性能化要求に応えるため、トランジスタの2次元構造化やゲート電極材料に応えるため、トランジスタの3次元構造化やゲート電極材料のメタル化、 また、キャパシタには新材料を導入して、メモリセルを構造設計・開発すると共に周辺回路用トランジスタとメタル配線プロセスを統合し、低コストでの生産性の高いDRAM製品の全生産プロセスを構築していきます。

    WorkStyle_2    デバイス素子設計
    デバイス素子設計は、PC、デジタル家電やスマートフォンをはじめとするモバイル機器など様々なDRAMの用途に応じてトランジスタを設計することが主な業務です。また、製品の高速・低消費電力化を実現するため、低コストかつ信頼性の高いトランジスタ開発が求められており、ゲート絶縁膜用の新材料や、極浅接合形成等の最先端技術の開発も重要な業務のひとつとなっています。現在、最先端DRAMに使用されているトランジスタのサイズ（ゲート長）は物理的な極限の領域に踏み込もうとしており、新技術を駆使してブレークスルーを果たすことが必要になっています。 このため、社内や国内に限らず、海外の研究開発拠点と議論を交えながらトランジスタの高性能化を行っています。さらに、半導体製品開発の基盤を支える業務です。

    WorkStyle_3    物理的解析技術
    DRAMの開発では、常に高いハードルを越えていく必要がありますが、チャレンジして成功することもあれば失敗することもあります。失敗からは何が問題だったかを科学的に理解し、プロセス改善を繰り返して課題を克服することが必要です。物理解析は、失敗から学ぶための技術と言っても過言ではなく、デバイス上で発生する数nm以下の特異事象を解明するために、高分解能のTEMをはじめ最先端のSTEMやSEM、微細な領域の加工や配線形成を行うことの出来るデュアルビームFIB、さらにナノスケールのデバイスを直接電気的に評価できるナノプローバーなどを駆使して行っています。当社では原子レベルの物理現象を解明し、世界トップレベルの解析技術力を誇っており、その成果は、製品の品質改善、歩留まり改善に大きく貢献しています。