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memory

Data center memory

Memory is key to keeping data flowing to your investment in processor technology – GPUs, CPUs, XPUs. With scalable options from industry-leading HBM3E, high-capacity RDIMMs (96GB and 128GB), memory expansion modules based on CXL, MRDIMM, SOCAMM, and DDR5, Micron has the industry’s broadest portfolio of data center memory solutions to keep your data-intensive AI workloads running. ​

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Technology Enablement Program for DDR5 MRDIMM

The Technical Enablement Program (TEP) for DDR5 MRDIMM offers a path into Micron for early access to technical information and support, electrical and thermal models, and memory products to aid in the design, development and introduction of next-generation computing platforms.

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Frequently asked questions

SOCAMM is our most power efficient memory solution for the data center.

Micron’s HBM3E 8-high and 12-high modules deliver:

  • An industry-leading pin speed of greater than 9.2Gbps and can support backward-compatible data rates of HBM2 first-generation devices,
  • Bandwidth of more than 1.2 TB/s per placement. ​
  • HBM3E 8-high provides 24GB capacity per placement and our HBM3E 12-high cube will deliver a jaw-dropping 36GB of capacity per placement. 

Our SOCAMM module leverages Micron’s LPDDR5X technology with a proven track record of capacity, performance, and energy efficiency

Yes, our CZ122 memory expansion modules are based on the CXL standards.

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