デザインツール
NAND flash

232-layer NAND flash memory

The next level of storage performance and density for a new wave of end-to-end technology innovation.

More layers, more innovation, more advanced

Micron extends 3D NAND technology leadership with our 232-layer NAND.

High performance

With the industry’s fastest NAND I/O speed of 2.4 GB/s, Micron's 232-layer NAND delivers the low-latency and high-throughput requirements of data-centric workloads, such as artificial intelligence, unstructured databases, real-time analytics and cloud computing.

Data density

The world's densest QLC NAND offers customers design flexibility while enabling the highest density per square millimeter for OEM manufacturers.1

Ubiquitous applications

Greater storage capacity — up to 1Tb per die and 2TB per package, allowed by increased layer stacking — provides more storage in more devices. This increased capacity enables smarter, more functional devices of all kinds, from the edge to the cloud.

First to ship 200+ layer QLC NAND¹

For the second time in a row, Micron ships the world’s highest layer count and the densest QLC NAND for OEMs and storage leaders. Micron 232-layer QLC NAND provides an industry-leading I/O performance of 2400 MT/s and helps bring QLC NAND into the mainstream.¹

Micron 232-Layer QLC NAND

The foundation for a new wave of end-to-end innovation

NAND is essential for keeping up with the insatiable demand for high-performance, responsive storage — from massive data centers to the smallest devices. Micron extends NAND leadership with the next-generation 232-layer NAND technology that enables faster, higher-capacity storage solutions.

Micron's 233 layer NAND infographic

First to market, second to none: The world’s first 232-layer NAND

Micron established NAND technology leadership in 2020 with the announcement of the first 176-layer 3D NAND. Micron extends this leadership with the availability and commercial ramp of the next-generation 232-layer NAND technology.

Skyscrapers

Micron NAND technology: Innovation and leadership extended

Delivering even denser storage and NAND design innovations provide new levels of performance and density for uses from edge to cloud.

233 layer

What can you do with 232 layers?

Micron CVP and GM, Jeremy Werner, and Pure Storage VP and GM, Bill Cerreta, sat down with industry analyst, Patrick Moorhead, to talk about Micron's new 232-layer NAND. They discussed whether layers or density matter more, how NAND can help address increasing demands on storage, and some use cases for 232-layer NAND.

What can you do with 232 layers.

Market segments

Featured resources

Design tools

Your single source for tools and resources needed to maximize Micron's products and solutions for your design needs.

Blue and purple technology circuit

1. NAND comparisons are based on publicly available information and Micron engineering data available at product launch for currently in production NAND from SK Hynix, Solidigm, Kioxia, WD and Samsung.

 

カスタマーサポート

マイクロンに連絡する必要がある場合は、サポートチームにお問い合わせいただき、各地域の連絡先情報を入手してください。

セールス

お問い合わせページのセールスサポートフォームにご記入のうえ、セールスサポートチームに直接お問い合わせください。

マイクロンのサンプルを注文する

マイクロンのメモリサンプルの発注と注文の追跡をオンラインで行えます。

ダウンロードとテクニカルドキュメント

製品の特徴や機能の詳細をご確認ください。また、設計に関するガイダンスをご入手いただけます。